Form D · Other Technology

HiLink Inc.

Chicago, IL · CIK 0001888748

Offering snapshot reported Jun 16, 2022 · SEC filing

Reported sold
$950K
Offering amount: $950K
Investors reported
11
Form D · investor count
Minimum accepted
$1
Reported outside-investor minimum
First sale
Oct 1, 2021
As reported in this filing

Fundraising history

Reported sold
Reported amount sold by Form D filing date$0$475K$950KOct 21, 2021: $75,000.00Oct 21, 2021Jun 16, 2022: $950,000.00Jun 16, 2022

Dates are filing dates, not cash receipt dates. Decreases are reported revisions, not evidence of withdrawals. Separate offering histories are not added together.

What changed?

Latest filing versus its linked predecessor, where available.

  • Reported sold$75,000 → $950,000
  • Reported investors1 → 11

Filing history

Scroll to see all columns →

FiledFiling typeReported soldChange vs linked filingInvestorsSource
Jun 16, 2022Amendment$950,000$875,000vs Oct 21, 202111SEC filing
Jun 15, 2022Initial$825,000No comparison2SEC filing
Oct 21, 2021Initial$75,000No comparison1SEC filing

Offering details

Securities
Equity, Debt, Option to acquire
Exemptions
06b
Duration over one year
No
Business combination
No
Sales commissions
$0
Finders' fees
$0
Form D file number
021-417965

Source: Form D, filed Jun 16, 2022. Minimum accepted may differ from a standard advertised minimum.

Fund connections

No confirmed ADV fund connection is available for this issuer.

People & organizations

Current and past Form D appearances. These existing records do not establish a person's current role or uniquely identify them across issuers.

People and organizations reported in Form D filings
NameReported role
Fuchen Wu Director, Executive

Issuer details

Industry: Other Technology (See others in industry)

Address:
401 N Michigan Ave Suite 750
Chicago, IL, 60611